J1030010-Solder Terminals​

1. Solder Terminals

Structure: Metal leads (e.g., pins, pads) are directly soldered onto the PCB. The leads are often tin-plated or gold-plated to enhance solderability and oxidation resistance. Working Principle: Heating melts the solder, filling the gap between the lead and the PCB pad. Upon cooling, a metallurgical bond is formed, achieving both electrical connectivity and mechanical fixation. Application Scenarios: Consumer electronics motherboards (e.g., smartphones, computers), power adapters, LED lighting devices, and other scenarios requiring dense wiring in compact spaces. For example, the charging interface of a mobile phone is connected to the motherboard via solder terminals to ensure stable transmission of high-frequency signals. Specification Dimensions:

• Lead Pitch: 0.4 mm to 2.54 mm (adaptable to different PCB design standards);
• Lead Length: 1 mm to 5 mm;
• Pad Diameter: 0.5 mm to 2 mm.

Summary

The selection of terminal types requires comprehensive consideration of electrical performance (current-carrying capacity, voltage resistance), mechanical performance (plugging force, vibration resistance), environmental factors (temperature, humidity), and cost requirements. Reasonably combining different types of terminals can enhance the stability, maintainability, and service life of electrical systems.